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US 8,350,346 B1Granted
Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
AssigneeInvenSense, Inc.
InventorsKegang Huang, Martin Lim, Steven S. Nasiri
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Abstract
An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.
Claims22
An integrated MEMS device comprising
- a first structure in a first sealed enclosure;
- and
- at least one second structure in a second sealed enclosure of greater volume than the first sealed enclosure, wherein the second sealed enclosure is at lower pressure than the first sealed enclosure, wherein a substrate defines part of the first and second sealed enclosures, wherein the substrate contains two or more etched cavities of different depths.
A MEMS device comprising:
- a substrate, wherein the substrate contains two or more cavities of different depths;
- a first structure within a first cavity of a first depth;
- and
- a second structure within a second cavity of a second depth, the first cavity sealed at a first pressure and the second cavity sealed at a second pressure;
- a first sealing region around the first cavity;
- and
- a second sealing region around the second cavity to maintain different pressures.
4 more elements
Dependencies are inferred from the claim text.