B81B 7/0006
Interconnects
Official title: {Interconnects}
B81B7/0006 (Interconnects) appears on 399 US grants and 473 published applications in this corpus.
Search patents in B81B- Granted patents
- 399
- Published applications
- 473
- Assignees
- 218
- Inventors
- 906
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 7 | 3 |
| 2002 | 7 | 8 |
| 2003 | 7 | 24 |
| 2004 | 19 | 20 |
| 2005 | 15 | 19 |
| 2006 | 10 | 8 |
| 2007 | 5 | 14 |
| 2008 | 8 | 11 |
| 2009 | 10 | 15 |
| 2010 | 8 | 10 |
| 2011 | 11 | 14 |
| 2012 | 8 | 14 |
| 2013 | 13 | 18 |
| 2014 | 14 | 26 |
| 2015 | 28 | 24 |
| 2016 | 25 | 26 |
| 2017 | 18 | 22 |
| 2018 | 19 | 30 |
| 2019 | 22 | 30 |
| 2020 | 33 | 39 |
| 2021 | 24 | 25 |
| 2022 | 20 | 20 |
| 2023 | 18 | 10 |
| 2024 | 15 | 14 |
| 2025 | 16 | 16 |
| 2026 | 8 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Waveguide structure26 May 2026US 12,640,454 B2Menlo Microsystems, Inc.
- Foundry-compatible process for integrated micro-speaker and microphone26 May 2026US 12,641,387 B2Vibrant Microsystems Inc.
- Wafer level vacuum packaging (WLVP) of thermal imaging sensor19 May 2026US 12,631,491 B2Meridian Innovation Pte Ltd
- Micromechanical component, sound transducer device, and method for producing a micromechanical component12 May 2026US 12,628,566 B2Robert Bosch GmbH
- Broadband radio frequency micro-actuator switch with high isolation24 Sep 2026US 2026/0290714 A1Dell Products L. P.
- Micro-electro-mechanical system package17 Sep 2026US 2026/0274649 A1Vanguard International Semiconductor Corporation
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Three dimensional trace for micro-electromechanical system (mems) devices27 Aug 2026US 2026/0250123 A1Lumentum Operations LLC
Most cited
By later US patents
- Air gap interconnect method227US 6,861,332 B2Intel Corporation · 2005
- Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules203US 6,876,056 B2Interuniversitair Microelektronica Centrum (IMEC) · 2005
- Microfluidic device with controlled substrate conductivity125US 7,195,986 B1Caliper Life Sciences, Inc. · 2007
- Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive111US 6,150,186 AFormFactor, Inc. · 2000
- Method of integrating MEMS device with low-resistivity silicon substrates96US 6,559,530 B2Raytheon Company · 2003