Three dimensional trace for micro-electromechanical system (mems) devices

A micro-electromechanical system (MEMS) device, comprising:

• a movable element;
• and
• an actuating layer disposed below the movable element and comprising:
• a first set of actuating elements configured to move the movable element in a first direction,
• wherein the first set of actuating elements is associated with a first set of electrodes connected to a first bus via a first set of electrical traces,
• a second set of actuating elements configured to move the movable element in a second direction,
• wherein the second set of actuating elements is associated with a second set of electrodes connected to a second bus via a second set of electrical traces,
• wherein the second set of electrical traces is disposed at least partially above the first bus.

A method, comprising:

• forming, by a manufacturing device on a first substrate, an electrode layer of a micro- electromechanical system (MEMS) device,
• wherein the electrode layer includes a first electrode and a second electrode,
• wherein the first electrode is connected to a first bus and the second electrode is connected to a second bus;
• forming, by the manufacturing device, a first post on top of the second electrode and a second post on top of the second bus;
• forming, by the manufacturing device on a second substrate, a bridge layer;
• and
• wafer bonding, by the manufacturing device, the bridge layer onto the first post and the second post, such that the first post is electrically connected to the second post by the bridge layer.