Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

An interconnect module comprising:

• a substrate;
• an interconnect section formed on the substrate;
• and
• a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the moveable element is formed from a metal layer which is formed from the same material as one of the two interconnect layers, and wherein the interconnect section comprises a first interconnect metal layer, a first intermediate dielectric layer formed on the first interconnect metal layer, a second interconnect metal layer formed on the first intermediate dielectric layer, a second intermediate dielectric layer formed on the second interconnect metal layer, and a third interconnect metal layer formed on the second intermediate dielectric layer, the moveable element being formed from the same material as the second interconnect metal layer.

An interconnect module comprising:

• a substrate;
• an interconnect section formed on the substrate;
• and
• a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the moveable element is formed from a metal layer which is formed from the same material as one of the two interconnect layers, and wherein the interconnect section comprises a first interconnect metal layer, a first intermediate dielectric layer formed on the first interconnect metal layer, a second interconnect metal layer formed on the first intermediate dielectric layer, a second intermediate dielectric layer formed on the second interconnect metal layer, and a third interconnect metal layer formed on the second intermediate dielectric layer, the moveable element being formed from the same material as the third interconnect metal layer.

An interconnect module comprising:

• a substrate;
• an interconnect section formed on the substrate, the interconnect section comprising fixed passive devices;
• and
• a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the fixed passive devices are connected to each other by at least one of the interconnect metal layers.