Micromechanical component, sound transducer device, and method for producing a micromechanical component

A sound transducer device, comprising:

• a micromechanical component, including:
• a substrate,
• a vibrating diaphragm connected to the substrate,
• at least one piezoelectric element arranged between the diaphragm and the substrate and connected to the diaphragm, wherein the at least one piezoelectric element is configured to produce and/or detect vibrations of the diaphragm in an ultrasonic range, and
• at least one electrical contact connection electrically connected to the at least one piezoelectric element,
• wherein the substrate is connected to the diaphragm and/or the at least one piezoelectric element using a bonded connection, wherein a circumferential insulation trench is formed in the substrate around at least one bonded connection;
• and
• a control circuit, wherein the micromechanical component is connected, using flip chip technology, to the control circuit, and wherein the at least one piezoelectric element of the micromechanical component is electrically connected to the control circuit using the at least one electrical contact connection.

A method for producing a micromechanical component, comprising the following steps:

• providing a substrate;
• forming a vibrating diaphragm connected to the substrate;
• providing at least one piezoelectric element arranged between the diaphragm and the substrate and connected to the diaphragm, wherein the at least one piezoelectric element is configured to produce and/or detect vibrations of the diaphragm in an ultrasonic range;
• and
• forming at least one electrical contact connection electrically connected to the at least one piezoelectric element, wherein the micromechanical component is configured to be connected, using flip chip technology, to a control circuit such that the at least one piezoelectric element can be electrically connected to the control circuit using the at least one electrical contact connection;
• wherein the substrate is connected to the diaphragm and/or the at least one piezoelectric element using a bonded connection, wherein a circumferential insulation trench is formed in the substrate around the bonded connection.