Integrated device package with carrier
AssigneeSkyworks Solutions, Inc.
InventorsTakanori Yasuda, Siarhei Dmitrievich Barsukou, Keiichi Maki, Hiroyuki Nakamura
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Abstract
An integrated device package is disclosed. The integrated device package can include a carrier that has an opening extending at least partially through a thickness of the carrier. The integrated device package can include a microelectronicmechanical systems die that is at least partially disposed in the opening and mechanically and electrically coupled to the carrier. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.
Claims20
A microphone package comprising:
- a carrier having a multilayer structure having a first layer and a second layer, the second layer above the first layer, the first layer has a first coefficient of thermal expansion, and the second layer has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion;
- and
- an integrated device die having a piezoelectric microphone element, the integrated device die mounted above the carrier, the second coefficient of thermal expansion is closer to a coefficient of thermal expansion of the integrated device die than to the first coefficient of thermal expansion.
An integrated device package comprising:
- a carrier having a multilayer structure having a first layer and a second layer, the second layer above the first layer, the first layer having a first coefficient of thermal expansion and the second layer having a second coefficient of thermal expansion greater than the first coefficient of thermal expansion;
- and
- a microelectronicmechanical systems die mounted on the carrier, the second coefficient of thermal expansion is closer to a coefficient of thermal expansion of the microelectronicmechanical systems die than to the first coefficient of thermal expansion.
Dependencies are inferred from the claim text.