Micro speaker structure with acoustic mesh
AssigneeFortemedia, Inc.
InventorsYu-Xuan Xu, Bin-Rong Li, Guan-Jun Huang, Shih-Chin Gong
Life of this patent
Estimating the term…
Abstract
A micro speaker structure is provided. The micro speaker structure includes a substrate, a diaphragm, a coil, a circuit board, and at least one acoustic mesh. The substrate has a hollow chamber. The diaphragm is disposed over the substrate and covers the hollow chamber. The coil is embedded in the diaphragm. The circuit board is attached to the substrate, wherein at least one vent hole passes through the top surface and the bottom surface of the circuit board. The acoustic mesh is disposed on the bottom surface of the circuit board to cover the vent hole. The acoustic mesh has a plurality of pores to allow sound to pass through, and the pores are smaller than the vent hole.
Claims19
A micro speaker structure, comprising:
- a substrate having a hollow chamber;
- a diaphragm disposed over the substrate and covering the hollow chamber;
- a coil embedded in the diaphragm;
- a circuit board attached to the substrate, wherein at least one vent hole passes through a top surface and a bottom surface of the circuit board;
- and
- at least one acoustic mesh disposed on the bottom surface of the circuit board to cover the at least one vent hole, wherein the at least one acoustic mesh has a plurality of pores to allow sound to pass through, and the pores are smaller than the at least one vent hole, wherein an average open area percentage of the pores is greater than 0.1% and less than 20%.
A micro speaker structure, comprising:
- a substrate having a hollow chamber;
- a diaphragm disposed over the substrate and covering the hollow chamber;
- a coil embedded in the diaphragm;
- a circuit board attached to the substrate and having at least one vent hole, wherein the at least one vent hole is configured to allow the hollow chamber to communicate with an external environment;
- at least one acoustic mesh disposed on a surface of the circuit board to cover the at least one vent hole, wherein the at least one acoustic mesh has a plurality of pores to allow sound to pass through, wherein a size of each of the pores is greater than 0.1 μm and less than 20 μm;
- and
- a lid wrapped around the substrate and the diaphragm, wherein the lid has an air opening that exposes a portion of the top surface of the diaphragm.
A micro speaker structure, comprising:
- a substrate having a hollow chamber;
- a diaphragm disposed over the substrate and covering the hollow chamber;
- a coil embedded in the diaphragm;
- a circuit board attached to the substrate and having at least one vent hole, wherein the at least one vent hole is configured to allow the hollow chamber to communicate with an external environment;
- a permanent magnetic element disposed on a top surface of the circuit board facing the diaphragm and in the hollow chamber, wherein the circuit board further has a cavity recessed from the top surface of the circuit board for accommodating the permanent magnetic element;
- at least one acoustic mesh disposed on a surface of the circuit board to cover the at least one vent hole, wherein the at least one acoustic mesh has a plurality of pores to allow sound to pass through, wherein a size of each of the pores is greater than 0.1 μm and less than 20 μm;
- and
- a lid wrapped around the substrate and the diaphragm, wherein the lid has an air opening that exposes a portion of the top surface of the diaphragm.
Dependencies are inferred from the claim text.