Integrated device package with opening in carrier
AssigneeSkyworks Solutions, Inc.
InventorsTakanori Yasuda, Siarhei Dmitrievich Barsukou, Keiichi Maki, Hiroyuki Nakamura
Life of this patent
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Abstract
An integrated device package is disclosed. The integrated device package can include a carrier that has an opening extending at least partially through a thickness of the carrier. The integrated device package can include a microelectronicmechanical systems die that is at least partially disposed in the opening and mechanically and electrically coupled to the carrier. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.
Claims20
An integrated device package comprising:
- a carrier with a multilayer structure having at least a first layer and a second layer that is thinner than the first layer, the second layer including a die mount portion with a first width and an opening having a second width that is narrower than the first width;
- an electronic component at least partially disposed in the opening die mount portion and mechanically and electrically coupled to the carrier;
- and
- a lid coupled to the carrier, the lid and the carrier at least partially defining a cavity, the lid and the electronic component spaced by a gap defining a back volume.
A printed circuit board comprising:
- a first portion having a first thickness;
- and
- a second portion having a second thickness thinner than the first thickness, the second portion including an acoustic cavity and a die mount portion configured to receive a piezo electric microelectronicmechanical systems microphone, the acoustic cavity having a width narrower than a width of the die mount portion.
A wireless communication device comprising:
- a microphone including a carrier having an opening extending at least partially through a thickness of the carrier, a piezoelectric microelectronicmechanical systems microphone die at least partially disposed in the opening and mechanically and electrically coupled to the carrier, and a lid coupled to the carrier, the lid and the piezoelectric microelectronicmechanical systems die microphone spaced by a gap defining a back volume;
- and
- a radio frequency front end in communication with the microphone.
Dependencies are inferred from the claim text.