Electronic devices including device packages having a port hole with a spark arrest shoulder and related methods

An electronic device comprising:

• a device package comprising:
• a multi-layer substrate;
• a port hole through the multi-layer substrate and comprising a first opening on a first side of the multi-layer substrate and a second opening on a second side of the multi-layer substrate, opposite to the first side;
• a device disposed on the first opening of the port hole and having a first voltage;
• an integrated circuit coupled to the device;
• and
• a spark arrestor comprising a first conductive layer of the multi-layer substrate disposed inside the port hole and coupled to a reference voltage.

A method of forming a package comprising:

• forming a multi-layer substrate;
• forming a port hole through the multi-layer substrate and comprising a first opening on a first side of the multi-layer substrate and a second opening on a second side of the multi-layer substrate, opposite to the first side;
• disposing a device having a first voltage on the first opening of the port hole;
• and
• forming a spark arrestor inside the port hole comprising a first conductive layer of the multi-layer substrate coupled to a reference voltage.