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US 2026/0296879 A1Published application
Micro-electro-mechanical system package and fabrication method thereof
AssigneeVanguard International Semiconductor Corporation
InventorsRANGANATHAN NAGARAJAN, GUOFU ZHOU, BUAN FEI CHAN
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Abstract
A MEMS package includes a first substrate, a stopper, a device layer, and a release opening. The first substrate includes a cavity therein. The stopper is disposed in the cavity and integrated with the first substrate. The device layer includes a MEMS device and is bonded to the first substrate. The release opening penetrates the device layer, corresponds to the stopper, and is disposed in the MEMS device.
Claims20
A micro-electro-mechanical system (MEMS) package, comprising:
- a first substrate, including a cavity therein;
- a stopper, disposed in the cavity and integrated with the first substrate;
- a device layer, comprising a MEMS device and bonded to the first substrate;
- and
- a release opening, penetrating the device layer, corresponding to the stopper, and disposed in the MEMS device.
2 more elements
A method of fabricating a micro-electro-mechanical system (MEMS) package, comprising:
- providing a first substrate;
- forming a cavity and a stopper by etching the first substrate, wherein the stopper is formed within the cavity and integrated with the first substrate;
- forming a bonding material layer to wrap around the first substrate, extending into the cavity and onto the stopper;
- forming a device layer on the first substrate to cover the cavity and the stopper, wherein the device layer is bonded to the first substrate through the bonding material layer;
- patterning the device layer to form a MEMS device and a release opening, wherein the release opening penetrates the device layer and corresponds to the stopper;
- and
- removing a portion of the bonding material layer within the cavity and on the stopper by etching to form a bonding layer, wherein an etchant flows through the release opening.
4 more elements
Dependencies are inferred from the claim text.