B81B 7/0074
3d packaging, i.e. encapsulation containing one or several mems devices arranged in
Official title: {3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board}
B81B7/0074 (3d packaging, i.e. encapsulation containing one or several mems devices arranged in) appears on 114 US grants and 139 published applications in this corpus.
Search patents in B81B- Granted patents
- 114
- Published applications
- 139
- Assignees
- 71
- Inventors
- 273
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 1 | 2 |
| 2005 | 1 | 0 |
| 2006 | 2 | 1 |
| 2007 | 1 | 5 |
| 2008 | 2 | 0 |
| 2009 | 2 | 4 |
| 2010 | 1 | 7 |
| 2011 | 3 | 2 |
| 2012 | 6 | 10 |
| 2013 | 5 | 6 |
| 2014 | 5 | 5 |
| 2015 | 6 | 9 |
| 2016 | 14 | 13 |
| 2017 | 9 | 15 |
| 2018 | 7 | 5 |
| 2019 | 6 | 8 |
| 2020 | 9 | 7 |
| 2021 | 5 | 7 |
| 2022 | 7 | 8 |
| 2023 | 5 | 10 |
| 2024 | 7 | 5 |
| 2025 | 5 | 7 |
| 2026 | 5 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Die stacking with controlled tilt and angular alignment31 Mar 2026US 12,589,990 B2STMicroelectronics International N. V.
- Micro-electro-mechanical system microphone package31 Mar 2026US 12,593,178 B2Fortemedia, Inc.
- High reliability sensor24 Feb 2026US 12,559,363 B2Texas Instruments Incorporated
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- MEMS Sensor Module9 Apr 2026US 2026/0097955 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Multi-chip sensor5 Mar 2026US 2026/0062286 A1Infineon Technologies AG
- Mems sensor with particle filter and method for producing it11 Dec 2025US 2025/0376370 A1Infineon Technologies AG
- Seal for microelectronic assembly6 Nov 2025US 2025/0343086 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019
- Miniature 3-dimensional package for MEMS sensors65US 6,918,297 B2Honeywell International Inc. · 2005
- Multi-surface mounting member and electronic device65US 7,040,922 B2Analog Devices, Inc. · 2006
- Multiple bond via arrays of different wire heights on a same substrate49US 9,583,456 B2Invensas Corporation · 2017
- Vertically integrated MEMS acceleration transducer43US 8,186,221 B2Freescale Semiconductor, Inc. · 2012