Seal for microelectronic assembly
AssigneeInvensas Bonding Technologies, Inc.
InventorsRajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed
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Abstract
Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
Claims14
A method of forming a microelectronic assembly, comprising:
- bonding a first insulating surface of a first microelectronic component to a second insulating surface of a second microelectronic component, the first insulating surface and the second insulating surface forming a bond joint where the first insulating surface and the second insulating surface make contact;
- and
- forming a seal over the bond joint, the seal covering the bond joint, the seal comprising a metallic material and sealing the bond joint between the first microelectronic component and the second microelectronic component.
A method of forming a microelectronic assembly, comprising:
- bonding a first insulating surface of a first microelectronic component to a second insulating surface of a second microelectronic component, the first insulating surface and the second insulating surface forming a bond joint where the first insulating surface and the second insulating surface make contact;
- forming a first channel in the first insulating surface;
- forming a second channel through the second microelectronic component, the second channel aligned with the first channel, the first channel and the second channel intersecting the bond joint;
- forming a seal within the first channel and the second channel, the seal being continuous from the first channel to the second channel, the seal comprising a metallic material and sealing the bond joint between the first microelectronic component and the second microelectronic component.
Dependencies are inferred from the claim text.