US 8,186,221 B2 · Vertically integrated MEMS acceleration transducer

Abstract

A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Claims15

Dependent claims

A transducer adapted to sense acceleration comprising:

a first substrate having a first surface;
a first proof mass movably coupled to said first surface and spaced apart from said first surface of said first substrate;
a second substrate having a second surface, said second substrate being coupled to said first substrate to form a hermetically sealed chamber with said second surface facing said first surface;
and
a second proof mass movably coupled to said second surface and spaced apart from said second surface of said second substrate, said first proof mass and said second proof mass being located in said hermetically sealed chamber, and said second proof mass being situated facing said first proof mass.

2 more elements

A method of producing a microelectromechanical systems (MEMS) transducer adapted to sense acceleration comprising:

forming a first sensor adapted to detect said acceleration, said first sensor including a first substrate having a first surface, a first proof mass movably coupled to said first surface and positioned in spaced apart relationship above said first surface, and first fixed electrodes formed on said first surface;
forming a second sensor adapted to detect said acceleration, said second sensor including a second substrate having a second surface, a second proof mass movably coupled to said second surface and positioned in spaced apart relationship above said first surface, and second fixed electrodes formed on said second surface;
and
after forming said first and second sensors, coupling said second substrate to said first substrate to form a hermetically sealed chamber such that said second surface faces said first surface, said first proof mass and said second proof mass being located in said hermetically sealed chamber, and said second proof mass is situated facing said first proof mass.

1 more element

Dependencies are inferred from the claim text.

Vertically integrated MEMS acceleration transducer

Life of this patent

Vertically integrated MEMS acceleration transducer

Life of this patent

Abstract

Claims15