High reliability sensor

A system, comprising:

• a printed circuit board;
• an electronic device attached to the printed circuit board and comprising:
• a first semiconductor die having:
• a side extending in a first plane of orthogonal first and second directions;
• a sensor circuit along the side of the first semiconductor die;
• and a conductive terminal extending outward from the side of the first semiconductor die along a third direction that is orthogonal to the first and second directions;
• a substrate connected to the conductive terminal and to the printed circuit board;
• and
• a second semiconductor die bonded to the first semiconductor die and having:
• a bottom side extending in a second plane of the first and second directions;
• a lateral side extending in a plane of the second and third directions;
• and an insulation layer, the bottom side spaced apart from and facing the side of the first semiconductor die to form a protected chamber for the sensor circuit, the lateral side of the second semiconductor die spaced apart from the conductive terminal along the first direction, the insulation layer extending along the lateral side of the second semiconductor die, and the insulation layer spaced apart from and facing the conductive terminal along the first direction.

A method of fabricating an electronic device, the method comprising:

• forming trenches in a semiconductor wafer;
• forming an insulation layer on sidewalls of the trenches;
• bonding the semiconductor wafer to another semiconductor wafer with the insulation layer of the sidewalls of the trenches laterally spaced apart from conductive terminals of the other semiconductor wafer;
• grinding a back side of the semiconductor wafer;
• etching the back side of the semiconductor wafer;
• and
• singulating the semiconductor wafer and the other semiconductor wafer to separate an electronic device from the semiconductor wafer and the other semiconductor wafer.