Multiple bond via arrays of different wire heights on a same substrate
AssigneeInvensas Corporation
InventorsCyprian Emeka Uzoh, Rajesh Katkar
Life of this patent
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Abstract
Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.
Claims20
An apparatus, comprising:
- a substrate;
- first wire bond wires (“first wires”) in a first region, the first wires extending from a surface of the substrate;
- second wire bond wires (“second wires”) in a second region, the second wires extending from the surface of the substrate;
- wherein the first wires and the second wires are external to the substrate;
- wherein the first region is disposed at least partially within the second region;
- wherein the first wires are of a first height;
- and
- wherein the second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires.
An apparatus, comprising:
- a substrate;
- first wire bond wires (“first wires”) in a first region, the first wires extending from a surface of the substrate;
- second wire bond wires (“second wires”) in a second region, the second wires extending from the surface of the substrate;
- wherein the first wires and the second wires are external to the substrate;
- wherein the first region is disposed at least partially within the second region;
- wherein the first wires are of a first height;
- wherein the second wires are of a second height greater than the first height for coupling of:
- at least one electronic component to the second wires disposed above the first wires;
- and
- at least one die to the first wires at least partially disposed within the second region.
An apparatus, comprising:
- a substrate;
- first wire bond wires (“first wires”) in a first region, the first wires extending away from a surface of the substrate;
- second wire bond wires (“second wires”) in a second region, the second wires extending away from the surface of the substrate;
- wherein the first wires and the second wires are external to the substrate;
- wherein the first wires are of a first height;
- and
- wherein the second wires are of a second height greater than the first height.
An apparatus, comprising:
- a first die and a second die;
- first wire bond wires of a first height extending from a surface of the first die;
- second wire bond wires of a second height greater than the first height extending from a surface of the second die;
- the first wire bond wires and the second wire bond wires external to the first die and the second die, respectively;
- and
- the first wire bond wires disposed at least partially within a first region defined by the second wire bond wires for a package-on-package configuration.
Dependencies are inferred from the claim text.