Micro-electro-mechanical system microphone package

A micro-electro-mechanical system (MEMS) microphone package, comprising:

• a first micro-electro-mechanical system (MEMS) sensor die having a first surface and a second surface opposite to the first surface;
• an integrated circuit (IC) die stacked on the first surface of the first MEMS sensor die;
• a first conductive lid disposed on the second surface of the first MEMS sensor die;
• an additional integrated circuit (IC) die stacked on the first surface of the first MEMS sensor die, wherein the IC die is positioned beside and directly connected to the additional IC die;
• a second MEMS sensor die stacked on and electrically connected to the additional IC die, wherein the first MEMS sensor die is positioned beside and directly connected to the second MEMS sensor die;
• and
• a second conductive lid disposed on the second MEMS sensor die and positioned beside the first conductive lid, wherein a first sidewall portion of the first conductive lid is positioned directly on the first MEMS sensor die, and a second sidewall portion of the second conductive lid is positioned directly on the second MEMS sensor die,
• wherein the first MEMS sensor die and the second MEMS sensor die are included in a micro-electro-mechanical system (MEMS) sensor wafer, the IC die and the additional IC die are included in an IC wafer provided for the MEMS sensor wafer to be stacked upon, and opposite edges of the MEMS sensor wafer are aligned with the corresponding opposite edges of the IC wafer.