Stacked die package and methods of forming the same

A method comprising:

• providing a first mold precursor module, which includes a multilayer laminate, an intact first device die, a floor connectivity die, and a first mold compound, wherein:
• the intact first device die includes a device layer, a silicon substrate over the device layer, and a plurality of first die interconnections extending from a bottom surface of the device layer towards a top surface of the multilayer laminate, while the floor connectivity die includes a sacrificial die body and a plurality of floor interconnections extending from a bottom surface of the sacrificial die body towards the top surface of the multilayer laminate;
• the first mold compound resides over the top surface of the multilayer laminate so as to encapsulate the intact first device die and the floor connectivity die;
• and
• each of the plurality of floor interconnections has a same height greater than a height of a combination of the device layer and the plurality of first die interconnections of the intact first device die;
• thinning down the first mold compound until the sacrificial die body of the floor connectivity die is completely consumed, such that each of the plurality of floor interconnections is exposed through the first mold compound;
• and
• mounting an intact second device die over the plurality of floor interconnections, wherein:
• the intact second device die includes an intact die body and a plurality of electrical second die interconnections extending from a bottom surface of the intact die body;
• and
• a layout arrangement of the plurality of electrical second die interconnections matches a layout arrangement of the plurality of floor interconnections, and each of the plurality of electrical second die interconnections is vertically aligned with and electrically connected to a corresponding floor interconnection.