Method of fabricating micro-electro-mechanical system package

A method of fabricating a micro-electro-mechanical system (MEMS) package, comprising:

• providing a handle wafer comprising a first cavity and a second cavity formed therein;
• providing a device wafer comprising:
• forming a first MEMS device and a second MEMS device laterally spaced apart from each other and in the device wafer;
• forming a first bond seal ring and a second bond seal ring corresponding to the first MEMS device and the second MEMS device, respectively;
• forming a hole in the second bond seal ring;
• and
• forming two pre-cut lines between the first MEMS device and the second MEMS device and in the device wafer;
• bonding the handle wafer to the device wafer, wherein the first cavity is directly above the first MEMS device, and the second cavity is directly above the second MEMS device;
• providing a wafer, wherein an interconnect layer is formed on the wafer;
• bonding the device wafer to the interconnect layer on the wafer at a first pressure;
• removing a portion of the handle wafer and a portion of the device wafer between the two pre-cut lines to expose the hole in the second bond seal ring at an ambient pressure;
• and
• forming a dielectric film on the interconnect layer.