B81B 7/0064
For protecting against electromagnetic or electrostatic interferences
Official title: {for protecting against electromagnetic or electrostatic interferences}
B81B7/0064 (For protecting against electromagnetic or electrostatic interferences) appears on 232 US grants and 242 published applications in this corpus.
Search patents in B81B- Granted patents
- 232
- Published applications
- 242
- Assignees
- 103
- Inventors
- 484
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 1 | 3 |
| 2003 | 4 | 4 |
| 2004 | 3 | 4 |
| 2005 | 3 | 7 |
| 2006 | 3 | 0 |
| 2007 | 3 | 7 |
| 2008 | 3 | 11 |
| 2009 | 3 | 7 |
| 2010 | 1 | 10 |
| 2011 | 9 | 10 |
| 2012 | 11 | 14 |
| 2013 | 17 | 13 |
| 2014 | 25 | 18 |
| 2015 | 31 | 11 |
| 2016 | 21 | 18 |
| 2017 | 14 | 14 |
| 2018 | 10 | 15 |
| 2019 | 15 | 16 |
| 2020 | 18 | 22 |
| 2021 | 6 | 6 |
| 2022 | 12 | 8 |
| 2023 | 9 | 5 |
| 2024 | 3 | 3 |
| 2025 | 5 | 12 |
| 2026 | 1 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Electronic devices including device packages having a port hole with a spark arrest shoulder and related methods15 Sep 2026US 12,740,424 B2RF360 Singapore Pte. Ltd.
- Antenna apparatus16 Dec 2025US 12,500,328 B2Sofant Technologies Ltd
- Embedded digital sensor structure9 Sep 2025US 12,410,053 B1Tacta Systems Inc.
- Sealed bonded structures and methods for forming the same29 Jul 2025US 12,374,641 B2Adeia Semiconductor Bonding Technologies Inc.
- Pressure sensor structure, pressure sensor device, and method of manufacturing pressure sensor structure1 Jul 2025US 12,345,593 B2Murata Manufacturing Co., Ltd.
- A micro-electro-mechanical system sensor and a preparation method thereof20 Aug 2026US 2026/0242210 A1Memsensing Microsystems (Suzhou, China) Co., Ltd.
- MEMS Sensor Module9 Apr 2026US 2026/0097955 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Wafer level package for device2 Apr 2026US 2026/0091974 A1Teknologian tutkimuskeskus VTT Oy
- Embedded Digital Sensor Structure29 Jan 2026US 2026/0028224 A1Tacta Systems Inc.
- Sealed bonded structures and methods for forming the same13 Nov 2025US 2025/0349773 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Microelectromechanical system package with environmental and interference shield293US 6,781,231 B2Knowles Electronics, LLC · 2004
- Encapsulated MEMS device and method to form the same254US 8,349,635 B1Silicon Laboratories Inc. · 2013
- Miniature silicon condenser microphone190US 7,166,910 B2Knowles Electronics, LLC · 2007
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Miniature silicon condenser microphone131US 7,242,089 B2Knowles Electronics, LLC · 2007