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US 7,166,910 B2Granted
Miniature silicon condenser microphone
AssigneeKnowles Electronics, LLC
InventorAnthony D. Minervini
Life of this patent
Estimating the term…
Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Claims33
A mems transducer comprising:
- a printed circuit board comprising a plurality of layers, at least one layer comprising a conductive material and at least one layer comprising an insulating material;
- a cover comprising a conductive layer, the printed circuit board and the cover forming at least a portion of a housing, the housing comprising an aperture for receiving a signal and an inner lining for providing a shield against an electromagnetic interference being formed by the conductive layer and at least one layer of a conductive material;
- a spacer member between the printed circuit board and the cover, the spacer member cooperating with the printed circuit board and the cover to form the housing, the spacer member comprising a sidewall at least partially covered by a conductive material, the conductive material providing a portion of the inner lining;
- and
- a transducer unit mounted within the housing.
2 more elements
A mems transducer comprising:
- a transducer unit;
- and
- a housing substantially covering the transducer unit and providing protection against an electromagnetic interference, the housing comprising a substrate, a spacer and a cover forming an interior of the housing in which the transducer unit is disposed, each of the substrate, the spacer and the cover comprising a layer of a non-conductive material and a layer of a conductive material substantially covering the layer of non-conductive material, the conductive layers being electrically coupled and substantially forming an inner lining of the housing, the housing further comprising an aperture for receiving a signal into the housing.
A silicon mems transducer comprising:
- a transducer unit;
- a substrate including an upper surface having a recess formed therein, the transducer unit attached to the upper surface of the substrate overlapping at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate;
- a cover placed over the transducer unit, the cover including an aperture;
- and
- a spacer disposed between the substrate and the cover, each of the substrate, the spacer and the cover comprising a layer of conductive material the conductive layers being electrically coupled and substantially forming an inner, shielding lining.
2 more elements
A silicon mems transducer comprising:
- a transducer unit;
- a substrate including an upper surface for supporting the transducer unit;
- a cover placed over a portion of the substrate, the cover comprising an aperture and an inner surface,
- a spacer disposed between the substrate and the cover, the spacer having in inner surface;
- and
- a portion of the cover inner surface and the spacer inner surface comprising a metallic material for shielding the transducer unit from an interference signal.
3 more elements
A mems transducer comprising:
- a transducer unit;
- a substrate including an upper surface for supporting the transducer unit;
- a cover sealed over a portion of the substrate, the cover having an aperture for receiving a signal;
- a spacer disposed between the substrate and the cover, the spacer having in inner surface;
- and
- a cover inner surface and a spacer inner surface each comprising a shielding material for protecting the transducer from an interference signal.
3 more elements
A mems transducer comprising:
- a transducer unit;
- a substrate comprising a layer of an insulating material and a layer of conductive material, the substrate further comprising a surface for supporting the transducer unit;
- a cover placed over a portion of the substrate;
- a spacer disposed between the substrate and the cover;
- and
- the cover and spacer each comprising a shielding material for protecting the transducer from an interference signal.
3 more elements
A mems transducer comprising:
- a printed circuit board comprising a first insulating layer and a first conductive layer;
- a transducer unit supported by the printed circuit board;
- and
- a cover over a portion of the printed circuit board and forming a housing therewith for protecting the transducer unit, the cover comprising an aperture, a second insulating layer, and a second conductive layer, a portion of the second conductive layer exposed to a conductive spacer and electrically connected to a ground via a conductive spacer for shielding the transducer from an interference signal.
1 more element
A mems transducer comprising:
- a printed circuit board comprising a first insulating layer, a first conductive layer, and an aperture;
- a transducer unit;
- and
- a cover over a portion of the printed circuit board and forming a housing therewith for protecting the transducer unit, the cover comprising a second insulating layer and a second conductive layer, a portion of the second conductive exposed to a conductive spacer and electrically connected to a ground via the conductive spacer for shielding the transducer from an interference signal.
1 more element
A mems transducer housing for a silicon mems transducer, the mems transducer housing comprising:
- an inner lining for providing a shield from an electromagnetic interference, the inner lining comprising an aperture adapted for receiving an acoustic signal;
- a circuit board comprising a first insulating layer and a first conductive layer, the first conductive layer forming at least a portion of the inner lining;
- a cover comprising a second conductive layer forming at least a portion of the inner lining;
- and
- a spacer member disposed between the circuit board and the cover, the spacer member including, the spacer member comprising a sidewall including a third conductive layer forming a portion of the inner lining, wherein the first conductive layer, the second conductive layer and the third conductive layer are electrically coupled to form the inner lining.
2 more elements
Dependencies are inferred from the claim text.