Embedded digital sensor structure
AssigneeTacta Systems Inc.
InventorsAndreas Bibl, Dariusz Golda, Patrick M. Smith
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Abstract
Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.
Claims21
An embedded sensor structure comprising:
- a sensor package including:
- an integrated circuit (IC) die including a front side and a back side;
- and
- a sensor die including a top side and a bottom side that is bonded to the front side of the IC die;
- wherein the sensor die includes a diaphragm that is deflectable toward a cavity;
- a planarization layer laterally surrounding the sensor package;
- and
- a metal routing to the top side of the sensor die, the metal routing spanning over the planarization layer.
A stretchable embedded sensor film comprising:
- a plurality of sensor packages embedded in a planarization layer laterally surrounding the plurality of sensor packages;
- wherein each sensor package includes;
- an integrated circuit (IC) die including a front side and a back side;
- and
- a sensor die including a top side and a bottom side that is bonded to the front side of the IC die;
- wherein the sensor die includes a diaphragm that is deflectable toward a cavity;
- and
- a metal routing spanning over the planarization layer and the top sides of the plurality of sensor dies.
Dependencies are inferred from the claim text.