Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

A radio frequency system compromising:

• at least one microelectromechanical (“MEMS”) device,
• at least a first plurality of LTCC layers forming at least one first circuit used in the operation of the MEMS device,
• at least a second plurality of LTCC layers forming at least one second circuit used in the operation of the MEMS device,
• the MEMS device being formed between the first and second pluralities of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the MEMS device is enclosed between the first and second pluralities of LTCC layers.

A MEMS device comprising:

• a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one first circuit layer and the buffer layer;
• a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, a plurality of radiation layers, and a plurality of interconnections between the second circuit layer, cover layer, and radiation layers;
• and
• a layer between the first and second ceramic modules including at least one microelectromechanical switch forming at least one phase-shifter.

A MEMS device comprising:

• a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer;
• a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer,
• a layer between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch, the second ceramic module being bonded to the first ceramic module, to thereby form a cavity in which the MEMS switch is located,
• a plurality of integrated circuits mounted on the first ceramic module,
• a plurality of interconnecting layers extending through the first plurality of dielectric layers for connecting the integrated circuits to the dielectric layers forming the first and second ceramic modules, and
• a plurality of discrete components buried-in the first and second pluralities of dielectric layers.

An electrical device comprising:

• a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one circuit layer and the buffer layer;
• a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, and a plurality of interconnections between the second circuit layer and the cover layer;
• and
• a layer formed between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch.

A radio frequency device compromising:

• a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers,
• a second substrate comprised of a second plurality of LTCC layers, and
• at least one microelectromechanical (“MEMS”) device between the first and second substrates,
• wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS device between the first and second substrates.

A device which operates at radio frequencies compromising:

• at least one microelectromechanical (“MEMS”) variable capacitor,
• a first substrate on which the MEMS variable capacitor is fabricated, the first substrate being comprised of a first plurality of tow-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, and
• a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device;
• and
• wherein the second substrate is bonded to the first substrate so as to enclose the MEMS variable capacitor between the first and second substrates.

A microelectromechanical variable capacitor device which operates at radio frequencies compromising:

• a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, and
• a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device;
• and
• wherein the second substrate is bonded to the first substrate so as to enclose the MEMS variable capacitor device between the first and second substrates.

A microelectromechanical (MEMS) tunable inductor device which operates at radio frequencies compromising:

• a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device,
• a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device;
• a plurality of radio frequency (“RF”) microelectromechanical switches fabricated on the first substrate,
• a network of parallel inductors also fabricated on the first substrate, and
• wherein the second substrate is bonded to the first substrate so as to enclose the RF MEMS switches and inductors between the first and second substrates.

A microelectromechanical systems (MEMS) tunable inductor-capacitor network device which operates at radio frequencies compromising:

• a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device or system,
• a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device,
• a plurality of RF microelectromechanical switches fabricated on the first substrate,
• a network of parallel inductor devices formed on the first substrate, and
• at least one variable capacitor device formed on the first substrate,
• wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS switches and inductor and capacitor devices between the first and second substrates.

An array antenna comprising:

• a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one first circuit layer and the buffer layer;
• a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, a plurality of radiation layers, and a plurality of interconnections between the second circuit layer, cover layer, and radiation layers;
• and
• a layer between the first and second ceramic modules including at least one microelectromechanical switch (“MEMS”) forming at least one phase-shifter.

A radio frequency system compromising:

• a plurality of modules formed on a low-temperature co-fired ceramic (“LTCC”) wafer, each of the modules including:
• at least one microelectromechanical (“MEMS”) device,
• at least a first plurality of LTCC layers forming at least one first circuit used in the operation of the MEMS device, and
• at least a second plurality of LTCC layers forming at least one second circuit used in the operation of the MEMS device,
• Wherein the MEMS device is formed between the first and second plurality of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the MEMS device is enclosed between the first and second pluralities of LTCC layers.