B81B 7/0045
For reducing stress inside of the package structure
Official title: {for reducing stress inside of the package structure}
B81B7/0045 (For reducing stress inside of the package structure) appears on 404 US grants and 523 published applications in this corpus.
Search patents in B81B- Granted patents
- 404
- Published applications
- 523
- Assignees
- 185
- Inventors
- 996
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 3 |
| 2004 | 3 | 8 |
| 2005 | 7 | 10 |
| 2006 | 3 | 8 |
| 2007 | 3 | 12 |
| 2008 | 4 | 13 |
| 2009 | 7 | 15 |
| 2010 | 8 | 19 |
| 2011 | 8 | 14 |
| 2012 | 11 | 15 |
| 2013 | 17 | 20 |
| 2014 | 20 | 22 |
| 2015 | 26 | 31 |
| 2016 | 25 | 40 |
| 2017 | 38 | 54 |
| 2018 | 28 | 22 |
| 2019 | 27 | 50 |
| 2020 | 46 | 42 |
| 2021 | 26 | 27 |
| 2022 | 23 | 28 |
| 2023 | 26 | 23 |
| 2024 | 24 | 26 |
| 2025 | 12 | 10 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Micromechanical sensor having increased sensitivity and a MEMS component having such a sensor9 Jun 2026US 12,650,442 B2Robert Bosch GmbH
- Stress isolation for integrated circuit package integration28 Apr 2026US 12,612,303 B2Analog Devices, Inc.
- Enhanced microelectromechanical system mirror apparatus31 Mar 2026US 12,591,133 B2Teknologian tutkimuskeskus VTT Oy
- High reliability sensor24 Feb 2026US 12,559,363 B2Texas Instruments Incorporated
- Anchor design with rejection of external shear force23 Dec 2025US 12,503,358 B2InvenSense, Inc.
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Carrying apparatus for carrying a mems sensor13 Aug 2026US 2026/0235407 A1Northrop Grumman LITEF GmbH
- Microsensor with a protective mass16 Jul 2026US 2026/0200725 A1
- Method for bonding a mems to a substrate25 Jun 2026US 2026/0176131 A1Exail
- Sensor Module And Vehicle11 Jun 2026US 2026/0159378 A1Seiko Epson Corporation
Most cited
By later US patents
- Packaging micromechanical devices79US 6,433,411 B1Agere Systems Guardian Corp. · 2002
- MEMS device structure and methods of forming same49US 9,139,420 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method of assembling micromechanical sensors47US 5,273,939 ARobert Bosch GmbH · 1993
- Package structure and method for making the same44US 6,784,020 B2Asia Pacific Microsystems, Inc. · 2004
- Hermetic seals for large optical packages and the like43US 6,639,313 B1Analog Devices, Inc. · 2003