Packaging micromechanical devices

A micro-electronic machined mechanical (MEMS) assembly comprising:

• (a) an interconnect substrate with a top and bottom surface, an array of contact pins extending from the top surface of the interconnect substrate,
• (b) a chamber assembly mounted on the interconnect substrate, the chamber assembly comprising:
• (i) a silicon substrate with a top and bottom surface,
• (ii) silicon sidewalls attached to the top surface of the silicon substrate, the silicon sidewalls combining with the silicon substrate to form a silicon chamber,
• (iii) a MEMS device mounted on the top surface of the silicon substrate within the silicon chamber, and
• (iv) a plurality of electrical contact pads on only the bottom surface of the silicon substrate, each of the electrical contact pads aligned with and contacting a contact pin extending from the top surface of the interconnect substrate.

A micro-electronic machined mechanical (MEMS) assembly comprising:

• (a) an interconnect substrate with a top and bottom surface, an array of contact pins extending from the top surface of the interconnect substrate,
• (b) a silicon substrate mounted on the interconnect substrate, the silicon substrate having a top surface and a bottom surface,
• (c) a MEMS device mounted on the top surface of the silicon substrate,
• (d) a plurality of electrical contact pads on only the bottom surface of the silicon substrate, each of the electrical contact pads aligned with and contacting a contact pin extending from the top surface of the interconnect substrate.