B81B 7/0054
Between other parts not provided for in b81b7/0048 - b81b7/0051
Official title: {between other parts not provided for in B81B7/0048 - B81B7/0051}
B81B7/0054 (Between other parts not provided for in b81b7/0048 - b81b7/0051) appears on 67 US grants and 81 published applications in this corpus.
Search patents in B81B- Granted patents
- 67
- Published applications
- 81
- Assignees
- 46
- Inventors
- 180
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 5 |
| 2010 | 0 | 3 |
| 2011 | 2 | 0 |
| 2012 | 1 | 1 |
| 2013 | 3 | 4 |
| 2014 | 4 | 4 |
| 2015 | 8 | 13 |
| 2016 | 6 | 3 |
| 2017 | 5 | 7 |
| 2018 | 6 | 3 |
| 2019 | 5 | 7 |
| 2020 | 7 | 9 |
| 2021 | 4 | 3 |
| 2022 | 3 | 5 |
| 2023 | 5 | 3 |
| 2024 | 1 | 4 |
| 2025 | 5 | 4 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Embedded digital sensor structure9 Sep 2025US 12,410,053 B1Tacta Systems Inc.
- Pressure sensors on flexible substrates for stress decoupling26 Aug 2025US 12,400,919 B2Infineon Technologies AG
- Methods and apparatus for electronic device packaging22 Jul 2025US 12,365,584 B2Texas Instruments Incorporated
- MEMS switch and manufacture method27 May 2025US 12,312,237 B2Beijing BOE Technology Development Co., Ltd.
- Bypass structure13 May 2025US 12,297,097 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microsensor with a protective mass16 Jul 2026US 2026/0200725 A1
- Embedded Digital Sensor Structure29 Jan 2026US 2026/0028224 A1Tacta Systems Inc.
- Methods and apparatus for electronic device packaging9 Oct 2025US 2025/0313454 A1
- Bypass structure31 Jul 2025US 2025/0243051 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectromechanical component with a metal standoff5 Jun 2025US 2025/0178887 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Low stress thin film microshells33US 7,595,209 B1Silicon Clocks, Inc. · 2009
- Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip11US 9,896,330 B2Texas Instruments Incorporated · 2018
- Method and apparatus for controlling Q losses through force distributions10US 9,143,057 B1Qualtre, Inc. · 2015
- Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications8US 10,131,540 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Mounting structures for integrated device packages7US 11,127,716 B2Analog Devices International Unlimited Company · 2021