Methods and apparatus for electronic device packaging
AssigneeTexas Instruments Incorporated
InventorsJane Liu, Richard Chen, William R. Morrison
Life of this patent
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Abstract
An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.
Claims20
A method comprising:
- applying first non-conductive layers to a first substrate, at least a portion of the first non-conductive layers mechanically coupled to a second substrate;
- applying a first heat treatment to the first non-conductive layers;
- after applying the first heat treatment to the first non-conductive layers, applying second non-conductive layers to the second substrate and to the first non-conductive layers;
- and
- applying a second heat treatment to the first non-conductive layers and the second non-conductive layers.
An apparatus comprising:
- a microelectromechanical system (MEMS) device having a first surface and a second surface;
- a substrate having a third surface;
- wire bonds electrically coupling the MEMS device and the substrate;
- and
- a non-conductive coating mechanically coupled to the wire bonds, the non-conductive coating including:
- first non-conductive layers adjacent to the first surface and the second surface;
- and
- second non-conductive layers adjacent to the third surface and the first epoxy layers.
A system comprising:
- a first substrate;
- a second substrate;
- wire bonds electrically coupling the first substrate and the second substrate;
- a non-conductive coating mechanically coupled to the first substrate, to the second substrate, and to the wire bonds, the non-conductive coating including:
- a first peak adjacent to the first substrate;
- and
- a second peak adjacent to the second substrate, the second peak over the wire bonds.
Dependencies are inferred from the claim text.