Mounting structures for integrated device packages
AssigneeAnalog Devices International Unlimited Company
InventorsRigan McGeehan, Cillian Burke, Alan J. O'Donnell
Life of this patent
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Abstract
An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.
Claims20
An integrated device package comprising:
- a carrier electrically connected to a package substrate;
- an integrated device die having a front side and a back side;
- and
- a mounting structure that serves to mount the back side of the integrated device die to the carrier, the mounting structure comprising a first adhesive layer over the carrier and a second element between the back side of the integrated device die and the first adhesive layer,
- wherein the first adhesive layer comprises a first insulating material that adheres to the carrier,
- wherein the second element comprises a second insulating material that electrically separates the integrated device die from an electrical interconnect connected to the carrier, the electrical interconnect comprises a bonding wire connecting the carrier and the package substrate, a portion of the bonding wire is disposed between the second element and the carrier, the portion of the bonding wire being embedded within the first adhesive layer, and
- wherein the second element comprises a spacer attached to the first adhesive layer, the spacer including a pathway to provide communication between an input terminal and an output terminal of the spacer.
A multi-layer mounting tape for attaching an integrated device die to a carrier and electrically isolating a back side of the integrated device die from the carrier, the multi-layer mounting tape comprising:
- a first layer comprising a first insulating material having a first flowable state and a second hardened state;
- a second layer over the first layer, the second layer comprising a second insulating material, the second layer comprising a means for electrical, optical, fluidic, magnetic, or wireless communication between an input terminal and an output terminal of the second layer, the means for communication configured to communicate with an external system or component that is external to the integrated device package;
- and
- a third layer over the second layer, such that the second layer is embedded between the first layer and the third layer, the third layer comprising a third insulating material, the third insulating material having a first flowable state and a second hardened state.
An integrated device package comprising:
- a carrier comprising a pad for receiving a bonding wire;
- an integrated device die having a front side and a back side;
- and
- a mounting structure that serves to mount the back side of the integrated device die to the carrier, the mounting structure comprising a first adhesive layer over the carrier and a spacer between the back side of the integrated device die and the first adhesive layer, at least a portion of the first adhesive layer positioned over the pad of the carrier, wherein the spacer includes a pathway, that provides communication between an input terminal and an output terminal of the spacer, the pathway configured to communicate between the carrier and the integrated device die, the pathway configured to communicate with an external system or component that is external to the integrated device package.
Dependencies are inferred from the claim text.