MEMS device structure and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChang-Chia Chang, Chen-Chih Fan, Bruce C. S. Chou
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Abstract
A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
Claims21
A method of forming a MEMS device comprising:
- forming an interconnect structure on a first substrate;
- depositing a dielectric layer on the interconnect structure;
- patterning the dielectric layer to form a central portion and two outer portions;
- bonding a MEMS wafer to the patterned dielectric layer;
- patterning the MEMS wafer to form a movable element, a central static element, and an outer static element, the movable element encircling the central static element, and the outer static element encircling the movable element;
- depositing a first bonding material on the central static element and the outer static element;
- forming two recesses in a second substrate, wherein the recesses form a central raised portion of the second substrate and two outer raised portions of the second substrate;
- depositing a second bonding material on the central raised portion and the outer raised portions of the second substrate;
- and
- bonding the MEMS wafer to the second substrate, wherein the central portion of the dielectric layer, the central static element, the first bonding material on the central static element, the second bonding material on the central raised portion, and the central raised portion form a first supporting post.
A method for forming a microelectromechanical system (MEMS) device comprising:
- forming an interconnect structure on a first substrate, the interconnect structure comprising more than one metal layer;
- forming a MEMS structure over the interconnect structure, wherein the MEMS structure comprises a movable element and an adjacent static element;
- forming a cavity surrounding the movable element;
- and
- bonding a second substrate to at least one of the MEMS structure and the interconnect structure, wherein the static element forms a first supporting post in the cavity, the first supporting post configured to support the first substrate.
A method of forming a MEMS device comprising:
- forming an interconnect structure on a first substrate;
- depositing a dielectric layer on the interconnect structure;
- patterning the dielectric layer to form a central portion and two outer portions;
- bonding a MEMS wafer to the patterned dielectric layer;
- patterning the MEMS wafer to form a movable element, a central static element, and an outer static element, the movable element encircling the central static element, and the outer static element encircling the movable element;
- depositing a first bonding material on the central static element and an outer portion of the interconnect structure;
- depositing a second bonding material on a second substrate;
- and
- bonding the second substrate to the MEMS wafer and the interconnect structure, wherein the central portion of the dielectric layer, the central static element, the first bonding material on the central static element, and the second bonding material on the second substrate form a first supporting post.
A method for forming a microelectromechanical system (MEMS) device comprising:
- forming an interconnect structure on a first substrate;
- forming a MEMS structure over the interconnect structure, wherein the MEMS structure comprises a movable element and a static element, the movable element encircling the static element;
- forming a cavity surrounding the movable element;
- and
- bonding a second substrate to at least one of the MEMS structure and the interconnect structure, wherein the static element forms a first supporting post in the cavity, the first supporting post configured to support the first substrate.
Dependencies are inferred from the claim text.