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US 2026/0159378 A1Published application
Sensor Module And Vehicle
AssigneeSeiko Epson Corporation
InventorToru WATANABE
Life of this patent
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Abstract
A sensor module includes a package having a first space and a second space overlapping when viewed from a first direction, a vibrator element and an integrated circuit disposed in the first space, and a MEMS sensor disposed in the second space, wherein the integrated circuit is electrically coupled to the vibrator element and the MEMS sensor, and the vibrator element, the integrated circuit, and the MEMS sensor overlap one another when viewed from the first direction.
Claims8
A sensor module comprising:
- a package having a first space and a second space overlapping when viewed from a first direction;
- a vibrator element and an integrated circuit disposed in the first space;
- and
- a MEMS sensor disposed in the second space, wherein the integrated circuit is electrically coupled to the vibrator element and the MEMS sensor, and
- the vibrator element, the integrated circuit, and the MEMS sensor overlap one another when viewed from the first direction.
2 more elements
Dependencies are inferred from the claim text.