B81B 7/0048
Between the mems die and the substrate
Official title: {between the MEMS die and the substrate}
B81B7/0048 (Between the mems die and the substrate) appears on 280 US grants and 363 published applications in this corpus.
Search patents in B81B- Granted patents
- 280
- Published applications
- 363
- Assignees
- 142
- Inventors
- 734
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 2 |
| 2004 | 3 | 7 |
| 2005 | 4 | 7 |
| 2006 | 1 | 6 |
| 2007 | 3 | 10 |
| 2008 | 4 | 10 |
| 2009 | 4 | 7 |
| 2010 | 6 | 14 |
| 2011 | 3 | 12 |
| 2012 | 10 | 12 |
| 2013 | 11 | 10 |
| 2014 | 14 | 13 |
| 2015 | 10 | 16 |
| 2016 | 18 | 30 |
| 2017 | 27 | 38 |
| 2018 | 20 | 16 |
| 2019 | 19 | 34 |
| 2020 | 34 | 32 |
| 2021 | 17 | 19 |
| 2022 | 19 | 24 |
| 2023 | 20 | 17 |
| 2024 | 16 | 16 |
| 2025 | 9 | 5 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Stress isolation for integrated circuit package integration28 Apr 2026US 12,612,303 B2Analog Devices, Inc.
- High reliability sensor24 Feb 2026US 12,559,363 B2Texas Instruments Incorporated
- Anchor design with rejection of external shear force23 Dec 2025US 12,503,358 B2InvenSense, Inc.
- Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit die9 Dec 2025US 12,494,419 B2STMicroelectronics (Malta) Ltd
- Pressure sensor assembly21 Oct 2025US 12,449,325 B2Infineon Technologies AG
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Carrying apparatus for carrying a mems sensor13 Aug 2026US 2026/0235407 A1Northrop Grumman LITEF GmbH
- Method for bonding a mems to a substrate25 Jun 2026US 2026/0176131 A1Exail
- Sensor Module And Vehicle11 Jun 2026US 2026/0159378 A1Seiko Epson Corporation
- Mems device with compensation of the mechanical stress and related manufacturing process4 Jun 2026US 2026/0152384 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Packaging micromechanical devices79US 6,433,411 B1Agere Systems Guardian Corp. · 2002
- Method of assembling micromechanical sensors47US 5,273,939 ARobert Bosch GmbH · 1993
- Package structure and method for making the same44US 6,784,020 B2Asia Pacific Microsystems, Inc. · 2004
- Temperature coefficient of offset adjusted semiconductor device and method thereof40US 5,994,161 AMotorola, Inc. · 1999
- Micro-electromechanical structure with improved insensitivity to thermomechanical stresses induced by the package39US 7,322,242 B2STMicroelectronics S,r.l. · 2008