B81B 7/0051
Between the package lid and the substrate
Official title: {between the package lid and the substrate}
B81B7/0051 (Between the package lid and the substrate) appears on 88 US grants and 110 published applications in this corpus.
Search patents in B81B- Granted patents
- 88
- Published applications
- 110
- Assignees
- 53
- Inventors
- 250
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 3 | 3 |
| 2006 | 1 | 2 |
| 2007 | 0 | 2 |
| 2008 | 0 | 3 |
| 2009 | 2 | 4 |
| 2010 | 2 | 3 |
| 2011 | 4 | 2 |
| 2012 | 0 | 2 |
| 2013 | 3 | 5 |
| 2014 | 2 | 3 |
| 2015 | 6 | 4 |
| 2016 | 3 | 11 |
| 2017 | 7 | 15 |
| 2018 | 9 | 5 |
| 2019 | 7 | 12 |
| 2020 | 10 | 8 |
| 2021 | 7 | 8 |
| 2022 | 5 | 2 |
| 2023 | 5 | 4 |
| 2024 | 9 | 6 |
| 2025 | 1 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods and apparatus for electronic device packaging22 Jul 2025US 12,365,584 B2Texas Instruments Incorporated
- MEMS actuators having a physical gap filled with fluid10 Dec 2024US 12,162,746 B1Mirrorcle Technologies, Inc.
- Method and structure for CMOS-MEMS thin film encapsulation5 Nov 2024US 12,134,555 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sensor devices with gas-permeable cover and associated production methods22 Oct 2024US 12,122,667 B2Infineon Technologies AG
- Wafer level packaging of MEMS17 Sep 2024US 12,091,311 B2Texas Instruments Incorporated
- Electronic device including a package with a cap coupled to a substrate with an improved resilience to the delamination and related manufacturing process12 Feb 2026US 2026/0047460 A1STMicroelectronics International N. V.
- Methods and apparatus for electronic device packaging9 Oct 2025US 2025/0313454 A1
- Mems actuators having a viscous liquid or gel located between a movable mirror and a substrate9 Jan 2025US 2025/0011161 A1Mirrorcle Technologies, Inc.
- Micromechanical component with external contacting26 Dec 2024US 2024/0425362 A1
- Stress isolation using three-dimensional trenches28 Nov 2024US 2024/0391758 A1Texas Instruments Incorporated
Most cited
By later US patents
- MEMS device structure and methods of forming same49US 9,139,420 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Hermetic seals for large optical packages and the like43US 6,639,313 B1Analog Devices, Inc. · 2003
- Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication34US 6,942,750 B2The Regents of the University of Michigan · 2005
- Package for sealing an integrated circuit die27US 6,911,727 B1Analog Devices, Inc. · 2005
- Packaging to reduce stress on microelectromechanical systems22US 9,156,673 B2Fairchild Semiconductor Corporation · 2015