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US 6,911,727 B1Granted
Package for sealing an integrated circuit die
AssigneeAnalog Devices, Inc.
InventorsJohn R. Martin, Carl M. Roberts, Jr.
Life of this patent
Estimating the term…
Abstract
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
Claims11
A semiconductor assembly comprising:
- a die having a substrate;
- a mass suspended over the substrate with anchors, and movable along a first direction, the movable mass having one or more fingers extending along a second direction perpendicular to the first direction;
- stationary plates, wherein movement of the movable fingers relative to the stationary plates cause a change in capacitance that is used to measure acceleration;
- and
- a cap bonded to the die, the cap surrounding the mass, the mass and the cap defining a space therebetween so that the cap does not contact the mass.
2 more elements
Dependencies are inferred from the claim text.