Electronic device including a package with a cap coupled to a substrate with an improved resilience to the delamination and related manufacturing process

A process for manufacturing an electronic device, comprising:

• forming a support structure comprising a substrate of dielectric material, a top conductive structure, arranged above the substrate, and a bottom conductive structure, arranged below the substrate, the top conductive structure comprising an annular region, the bottom conductive structure comprising an array of contacts;
• coupling a cap to the annular region in such a way that the cap and the support structure delimit a cavity;
• and
• arranging in the cavity at least one semiconductive die configured to generate one or more electric output signals;
• and wherein the array of contacts comprises:
• signal contacts, which are electrically coupled to the at least one semiconductive die and are configured to receive, in use, corresponding electric output signals or electric signals generated outside the electronic device and directed towards the at least one semiconductive die;
• and
• reference contacts, which are configured to be set, in use, to a reference potential;
• and wherein the process for manufacturing an electronic device further comprises forming a plurality of reinforcement conductive vias, each of which extends through the substrate and has ends fixed respectively to the annular region and to a corresponding reference contact.