B81B 7/007
Interconnections between the mems and external electrical signals
Official title: {Interconnections between the MEMS and external electrical signals}
B81B7/007 (Interconnections between the mems and external electrical signals) appears on 791 US grants and 896 published applications in this corpus.
Search patents in B81B- Granted patents
- 791
- Published applications
- 896
- Assignees
- 284
- Inventors
- 1,459
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 2 |
| 2002 | 10 | 13 |
| 2003 | 9 | 14 |
| 2004 | 11 | 16 |
| 2005 | 15 | 30 |
| 2006 | 14 | 23 |
| 2007 | 10 | 38 |
| 2008 | 19 | 26 |
| 2009 | 13 | 20 |
| 2010 | 19 | 23 |
| 2011 | 26 | 35 |
| 2012 | 23 | 24 |
| 2013 | 25 | 41 |
| 2014 | 43 | 55 |
| 2015 | 71 | 75 |
| 2016 | 84 | 78 |
| 2017 | 67 | 57 |
| 2018 | 49 | 64 |
| 2019 | 65 | 50 |
| 2020 | 54 | 50 |
| 2021 | 32 | 37 |
| 2022 | 34 | 34 |
| 2023 | 24 | 22 |
| 2024 | 29 | 26 |
| 2025 | 16 | 29 |
| 2026 | 14 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer level package for device29 Sep 2026US 12,747,155 B2Teknologian tutkimuskeskus VTT Oy
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Crossovers for vacuum packaging4 Aug 2026US 12,698,202 B2Obsidian Sensors, Inc.
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Microelectromechanical device and a method20 Aug 2026US 2026/0242204 A1Murata Manufacturing Co., Ltd.
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Micro-electro-mechanical system package20 Aug 2026US 2026/0242212 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Microfluidic chip having integrated electrodes303US 6,939,451 B2Aclara Biosciences, Inc. · 2005
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Vacuum package fabrication of microelectromechanical system devices with integrated circuit components166US 6,479,320 B1Raytheon Company · 2002