Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

A method for vacuum packaging MEMS devices during the MEMS fabrication process, comprising:

• fabricating on a device wafer a plurality of MEMS devices;
• fabricating one or more device mating pads on the device wafer, the mating pads selectively coupled to the MEMS devices;
• forming a plurality of first sealing rings surrounding both one of the plurality of MEMS devices and the one or more mating pads selectively coupled to the MEMS device;
• fabricating on a lid wafer a plurality of CMOS or other integrated circuit devices;
• fabricating one or more lid mating pads on the lid wafer, the one or more lid mating pads corresponding in position to the one or more device mating pads selectively coupled to the MEMS device to enable selective electrical connection of the CMOS or other integrated circuit devices to selected MEMS devices;
• fabricating one or more bonding pads on either the one or more device mating pads or the one or more lid mating pads;
• forming on the lid wafer a plurality of second sealing rings, each of the plurality of second sealing rings surrounding one of the plurality of CMOS or other integrated circuit devices and the one or more lid mating pads of the CMOS or other integrated circuit devices, each of the plurality of second sealing rings positioned between the perimeter of the CMOS or other integrated circuit device and one or more bonding pads coupled to the COMOS or other integrated circuit device;
• forming a solder layer on either each of the plurality of first sealing rings or on each of the plurality of second sealing rings;
• and
• mating the device wafer with the lid wafer in a vacuum environment to form a vacuum package within each of the plurality of first sealing rings and second sealing rings, each vacuum package enclosing one or more of the plurality of MEMS devices and one or more of the CMOS or other integrated circuit devices thereby selectively interconnected through one or more bonding pads.

A method for vacuum packaging MEMS devices during the MEMS fabrication process, comprising:

• fabricating on a device wafer a plurality of MEMS devices;
• fabricating one or more device mating pads on the device wafer, the mating pads selectively coupled to the MEMS devices;
• fabricating on a lid wafer a plurality of CMOS or other integrated circuit devices;
• fabricating one or more lid mating pads on the lid wafer, the one or more lid mating pads corresponding in position to the one or more device mating pads selectively coupled to the MEMS device to enable selective electrical connection of the CMOS or other integrated circuit devices to selected MEMS devices;
• fabricating one or more bonding pads on either the one or more device mating pads or the one or more lid mating pads;
• forming on the lid wafer a plurality of second sealing rings, each of the plurality of second sealing rings surrounding one of the plurality of CMOS or other integrated circuit devices and the one or more mating pads of the CMOS or other integrated circuit devices, each of the plurality of second sealing rings positioned between the perimeter of the CMOS or other integrated circuit device and one or more bonding pads coupled to the CMOS or other integrated circuit device;
• forming a sealing layer on either each of the plurality of first sealing rings or on each of the plurality of second sealing rings;
• mating the device wafer with the lid wafer in a vacuum environment to form a vacuum package within each of the plurality of first sealing rings and second sealing rings, each vacuum package enclosing one or more of the plurality of MEMS devices and one or more of the CMOS or other integrated circuit devices thereby selectively interconnected through one or more bonding pads;
• opening a plurality of probe access channels in the lid wafer following the formation of a plurality of vacuum packages, the plurality of probe access channels providing access to the bonding pads for testing of a plurality of vacuum packaged integrated circuit devices;
• testing each of the plurality of vacuum packaged integrated circuit devices by probing the bonding pads coupled to each integrated circuit device;
• and
• dicing the plurality of vacuum packaged integrated circuit devices following testing thereof.

A vacuum package containing a MEMS device and one or more integrated circuit devices, comprising:

• a MEMS device fabricated on a device wafer;
• one or more device mating pads fabricated on the device wafer, the device mating pads selectively coupled to the MEMS device;
• a sealing ring formed around the perimeter of the MEMS device and the one or more device mating pads associated with the MEMS device, the sealing ring surrounding the MEMS device and the device mating pads;
• one or more integrated circuit devices fabricated on a lid wafer;
• one or more lid mating pads fabricated on the lid wafer, the one or more lid mating pads corresponding in location to the one or more device mating pads to enable selective electrical connection of the MEMS device to the one or more integrated circuit devices;
• one or more bonding pads on either of the one or more device mating pads or the one or more lid mating pads;
• and
• wherein the sealing ring seals the lid wafer to the device wafer providing a vacuum package enclosing the MEMS device and the one or more integrated circuit devices, each of the one or more device mating pads coupled to the corresponding one of the one or more lid mating pads by the one or more bonding pads.