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AssigneeVanguard International Semiconductor Corporation
InventorsROHIT PULIKKAL KIZHAKKEYIL, RAKESH CHAND, Tze Sheong Neoh, GUOFU ZHOU, HUP FONG TAN, RAMACHANDRAMURTHY PRADEEP YELEHANKA
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A MEMS package includes an interconnect layer disposed on a first substrate. The interconnect layer includes a second metal layer disposed below and thicker than a first metal layer. A first dielectric layer is disposed on the first metal layer. A second dielectric layer is disposed between the first and second metal layers. An opening passes through the first and second dielectric layers to expose a portion of the second metal layer. A MEMS device layer is bonded on the interconnect layer. A second substrate includes a cavity and is bonded on the MEMS device layer.
A micro-electro-mechanical system (MEMS) package, comprising:
Dependencies are inferred from the claim text.