Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

An integrated system, comprising:

• a printed circuit board (PCB);
• and
• an integrated microelectronic device, comprising:
• a sensor chip including a first sensor and a first sensor chip substrate, wherein the first sensor chip substrate is affixed to a first side of an interposer by a hermetic seal, the first sensor hermetically sealed within a first cavity;
• an integrated circuit (IC) chip affixed to a second side of the interposer opposite the first sensor, the IC chip electrically coupled to the first sensor by a through via in the interposer, wherein the first sensor comprises a first micro-electro-mechanical system (MEMS) including a mechanically displaceable structure anchored to the first sensor chip, and wherein the IC chip comprises an amplifier circuit to amplify a signal received from the first sensor conducted by the through via;
• and
• a second sensor chip affixed to the first side of the interposer, the second sensor chip including a second sensor hermetically sealed within a second cavity by the interposer,
• wherein the interposer further comprises lateral electrical interconnect traces electrically coupling board solder joints affixed to the PCB to at least one of:
• the IC chip, the first sensor chip, and the second sensor chip.

A mobile computing platform, comprising:

• a display screen;
• a battery;
• an antenna;
• and
• an integrated system, comprising:
• a printed circuit board (PCB);
• and
• an integrated microelectronic device, comprising:
• a sensor chip including a first sensor and a first sensor chip substrate, wherein the first sensor chip substrate is affixed to a first side of an interposer by a hermetic seal, the first sensor hermetically sealed within a first cavity;
• and
• an integrated circuit (IC) chip affixed to a second side of the interposer opposite the first sensor, the IC chip electrically coupled to the first sensor by a through via in the interposer, wherein the first sensor comprises a first micro-electro-mechanical system (MEMS) including a mechanically displaceable structure anchored to the first sensor chip, and wherein the IC chip comprises an amplifier circuit to amplify a signal received from the first sensor conducted by the through via;
• and
• a second sensor chip affixed to the first side of the interposer, the second sensor chip including a second sensor hermetically sealed within a second cavity by the interposer,
• wherein the interposer further comprises lateral electrical interconnect traces electrically coupling board solder joints affixed to the PCB to at least one of:
• the IC chip, the first sensor chip, and the second sensor chip.