Crossovers for vacuum packaging
AssigneeObsidian Sensors, Inc.
InventorsJohn Hong, Tallis Chang, Sean Andrews, Jan Bos, Jia-Wei Ma
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Abstract
In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.
Claims17
A method for manufacturing electromechanical systems, comprising:
- providing a semiconductor layer having a planar surface;
- forming conductive regions and adjacent non-conductive regions in the semiconductor layer by modifying a composition of the semiconductor layer,
- wherein the planar surface comprises surfaces of the conductive regions and the non-conductive regions;
- applying a hermetic seal above the planar surface to create a hermetically sealed volume, wherein:
- a conductive region of the conductive regions comprises a first part disposed below the hermetically sealed volume and a second part disposed outside the hermetically sealed volume;
- and
- oxidizing the non-conductive regions, wherein:
- the oxidizing is performed after formation of the conductive regions;
- the oxidizing selectively converts the non-conductive regions into an electrically insulating oxide;
- the electrically insulating oxide is retained to electrically isolate adjacent conductive regions;
- and
- the oxidizing is not performed for dopant diffusion or dopant drive-in.
Dependencies are inferred from the claim text.