B81B 7/0058
For protecting against damages due to external chemical or mechanical influences
Official title: {for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations}
B81B7/0058 (For protecting against damages due to external chemical or mechanical influences) appears on 286 US grants and 341 published applications in this corpus.
Search patents in B81B- Granted patents
- 286
- Published applications
- 341
- Assignees
- 140
- Inventors
- 642
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 3 | 3 |
| 2006 | 1 | 8 |
| 2007 | 2 | 15 |
| 2008 | 7 | 1 |
| 2009 | 2 | 8 |
| 2010 | 1 | 6 |
| 2011 | 7 | 9 |
| 2012 | 4 | 8 |
| 2013 | 12 | 13 |
| 2014 | 23 | 26 |
| 2015 | 30 | 27 |
| 2016 | 25 | 28 |
| 2017 | 24 | 27 |
| 2018 | 20 | 29 |
| 2019 | 26 | 21 |
| 2020 | 15 | 27 |
| 2021 | 22 | 14 |
| 2022 | 13 | 23 |
| 2023 | 11 | 18 |
| 2024 | 16 | 9 |
| 2025 | 13 | 14 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Sensor assembly and methods of manufacturing thereof17 Feb 2026US 12,553,751 B2APPLIED Materials.Inc.
- Packaging for a sensor and methods of manufacturing thereof17 Feb 2026US 12,553,752 B2APPLIED Materials.Inc.
- Bottom package exposed die MEMS pressure sensor integrated circuit package design3 Feb 2026US 12,543,575 B2STMicroelectronics S.r.l.
- Protective bondline control structure6 Jan 2026US 12,515,944 B2Texas Instruments Incorporated
- Microsensor with a protective mass16 Jul 2026US 2026/0200725 A1
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
- Method for bonding a mems to a substrate25 Jun 2026US 2026/0176131 A1Exail
- Environmental barrier structure with integrated fluid channel12 Feb 2026US 2026/0042661 A1Infineon Technologies AG
- Packaging for a sensor and methods of manufacturing thereof5 Feb 2026US 2026/0036454 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Semiconductor device with a protective sheet to affix a semiconductor chip95US 6,255,741 B1Denso Corporation · 2001
- Method of manufacturing a microphone95US 7,434,305 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method91US 7,381,589 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method89US 8,018,049 B2Knowles Electronics, LLC · 2011
- MEMS device structure and methods of forming same49US 9,139,420 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015