Sensor assembly and methods of manufacturing thereof
AssigneeApplied Materials, Inc.
InventorVijay Parkhe
Life of this patent
Estimating the term…
Abstract
A sensor assembly includes a substrate having an outer region, an inner region, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the middle region or the outer region to provide a hermetic seal. The sensor assembly further includes a sensor die bonded to the substrate at the inner region. A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum, and/or one or more metals selected from tin, indium, copper, aluminum, and/or nickel.
Claims20
A sensor assembly comprising:
- a substrate comprising an outer region comprising a first distal end of the substrate, an inner region comprising an opposite second distal end of the substrate, and a middle region positioned between the outer region and the inner region, the substrate further comprising one or more electrical contact pads extending along a surface of the substrate from the outer region to the inner region;
- a flange coupled to the substrate at the middle region of the substrate or the outer region of the substrate, wherein the flange is configured to couple with a housing to provide a hermetic seal;
- and
- a sensor die bonded to the substrate at the inner region, wherein a metal bond bonds one or more electrodes of the sensor die to the one or more electrical contact pads at the inner region, the metal bond comprising:
- a) platinum;
- or
- b) at least two metals each selected from a group consisting of tin, indium, copper, aluminum, and nickel.
A method of manufacturing a sensor assembly, the method comprising:
- providing a substrate comprising an outer region comprising a first distal end of the substrate, an inner region comprising an opposite second distal end of the substrate, and a middle region positioned between the outer region and the inner region, the substrate further comprising a first electrical contact pad and a second electrical contact pad extending along a surface of the substrate from the outer region to the inner region;
- providing a sensor die comprising a first electrode and a second electrode, wherein the first electrode comprises a first metal wire that extends from the sensor die and the second electrode comprises a second metal wire that extends from the sensor die;
- positioning the sensor die onto the inner region of the substrate such that a portion of the first metal wire is overlaid on the first electrical contact pad and the second metal wire is overlaid on the second electrical contact pad;
- bonding the first metal wire to the first electrical contact pad by a first welding operation;
- bonding the second metal wire to the second electrical contact pad by a second welding operation;
- and
- coupling the substrate to a flange at the middle region of the substrate or the outer region of the substrate, wherein the flange is configured to couple with a housing to provide a hermetic seal.
A method of manufacturing a sensor assembly, the method comprising:
- providing a substrate comprising an outer region comprising a first distal end of the substrate, an inner region comprising an opposite second distal end of the substrate, and a middle region positioned between the outer region and the inner region, the substrate further comprising one or more electrical contact pads on at least the inner region;
- providing a sensor die comprising one or more electrodes;
- disposing a sheet of multilayer reactive foil onto at least one of a) the one or more electrical contact pads of the substrate or b) the one or more electrodes of the sensor die;
- positioning the sensor die onto the inner region of the substrate such that the sheet of multilayer reactive foil is sandwiched between the one or more electrical contact pads and the one or more electrodes;
- igniting the sheet of multilayer reactive foil to form a metal bond between the one or more electrical contact pads of the substrate and the one or more electrodes of the sensor die;
- and
- coupling the substrate to a flange at the middle region of the substrate or the outer region of the substrate, wherein the flange is configured to couple with a housing to provide a hermetic seal.
Dependencies are inferred from the claim text.