Bottom package exposed die MEMS pressure sensor integrated circuit package design

A device, comprising:

• a package having a first side and a second side that faces away from the first side, the package including:
• a MEMS semiconductor on the first side of the package, the MEMS semiconductor die including:
• a first surface exposed at the first side of the package;
• a second surface facing away from the first surface;
• an internal chamber;
• a sensing component within the internal chamber;
• and
• an aperture extending into the first surface of the MEMS semiconductor die, the aperture extending from the first surface of the MEMS semiconductor die to the internal chamber;
• a lead frame on the second side of the package, the lead frame having a third surface and a fourth surface facing away from the third surface, the third surface is exposed at the second side of the package;
• a second die including a fifth surface and a sixth surface, the fifth surface coupled to the second surface of the MEMS semiconductor die by a conductive adhesive that electrically couples the second die to the MEMS semiconductor die;
• a molding compound partially covering the MEMS semiconductor die and the lead frame, the first surface of the MEMS semiconductor die being flush with the molding compound at the first side of the package, the fourth surface of the lead frame being flush with the molding compound at the second side of the package;
• and
• a plurality of electrical connectors coupling the third surface of the lead frame to the sixth surface of the second die, the plurality of electrical connectors electrically coupling the lead frame to the second die.

A device, comprising:

• a molding compound having a first side a second side opposite to the first side;
• a MEMS semiconductor in the molding compound, the MEMS semiconductor including:
• a first surface exposed from the first side of the molding compound;
• a second surface opposite to the first surface and facing away from the first surface;
• an internal chamber;
• a sensing component within the internal chamber;
• and
• an aperture extending into the first surface to the internal chamber;
• a lead frame in the molding compound and at the second side of the package, the lead frame having a third surface exposed from the molding compound and a fourth surface opposite to the third surface;
• a second die in the molding compound, the second die including a fifth surface exposed from the molding compound and a sixth surface opposite to the fifth surface, the fifth surface of the second die is coupled to the second surface of the MEMS semiconductor;
• and
• a plurality of electrical connection structures are coupled to the second die and the lead frame.