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US 6,255,741 B1Granted
Semiconductor device with a protective sheet to affix a semiconductor chip
AssigneeDenso Corporation
InventorsShinji Yoshihara, Sumitomo Inomata, Kinya Atsumi, Minekazu Sakai, Yasuki Shimoyama, Tetsuo Fujii
Life of this patent
Estimating the term…
Abstract
A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.
Claims36
A semiconductor device comprising:
- a semiconductor chip having a semiconductor structure that is exposed on a main surface of the semiconductor chip;
- a pad provided on the semiconductor chip for an electrical connection;
- a wire connected to the pad;
- a main side protective resin sheet disposed on the main surface of the semiconductor chip to cover the semiconductor structure and having an opening from which the pad is exposed and the wire protrudes;
- a main side heat resisting adhesive disposed between the main side protective resin sheet and the semiconductor chip for fixing the main side protective resin sheet to the semiconductor chip,
- wherein the main side protective resin sheet and the main side heat resisting adhesive have first and second heat resisting temperatures that are higher than a first temperature capable of fixing the wire to the pad by bonding,
- the pad is surrounded by the main side protective resin sheet forming the opening portion;
- and
- the main side protective resin sheet continuously extends from a first region covering the semiconductor structure to a second region forming the opening portion;
- a lead frame fixedly holding the semiconductor chip thereon on a side opposite the main side protective resin sheet;
- and
- a resin member encapsulating the semiconductor chip and the lead frame therein with a specific shape,
- wherein the first and second heat resisting temperatures are higher than second and third temperatures, the second temperature being capable of fixing the semiconductor chip onto the lead frame, the third temperature being capable of molding the resin member into the specific shape.
10 more elements
A semiconductor device comprising:
- a semiconductor chip;
- a main side protective resin sheet made of a heat resisting resin and disposed on the semiconductor chip;
- a main side heat resisting adhesive disposed between the main side protective resin sheet and the semiconductor chip for fixing the main side protective resin sheet to the semiconductor chip;
- a resin member encapsulating the semiconductor chip and the main side protective resin sheet therein with a specific shape,
- wherein the main side protective resin sheet and the main side heat resisting adhesive have first and second heat resisting temperatures that are higher than a molding temperature capable of molding the resin member into the specific shape, and
- a back side protective resin sheet bonded to the semiconductor chip on a side opposite the main side protective resin sheet,
- wherein the back side protective resin sheet has a third heat resisting temperature that is higher than the molding temperature.
4 more elements
A semiconductor device comprising:
- a semiconductor chip;
- a main side heat resisting adhesive disposed on the semiconductor chip;
- a main side protective resin sheet made of a heat resisting resin and fixed to the semiconductor chip with the main side heat resisting adhesive interposed therebetween;
- a package fixedly accommodating the semiconductor chip and the main side protective resin sheet therein,
- wherein the main side protective resin sheet and the main side heat resisting adhesive have first and second heat resisting temperatures are higher than a fixing temperature capable of fixing the semiconductor chip to the package, and
- a back side protective resin sheet bonded to the semiconductor chip on a side opposite the main side protective resin sheet,
- wherein the semiconductor chip is fixed to the package by the back side protective resin sheet;
- and
- wherein the back side protective resin sheet has a third heat resisting temperature that is higher than said fixing temperature.
6 more elements
Dependencies are inferred from the claim text.