Packaging for a sensor and methods of manufacturing thereof
AssigneeApplied Materials, Inc.
InventorsSrikanth Krishnamurthy, Ming Xu, Ashley M. Okada
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AssigneeApplied Materials, Inc.
InventorsSrikanth Krishnamurthy, Ming Xu, Ashley M. Okada
Estimating the term…
Certain embodiments of the present disclosure relate to a sensor assembly including a housing having a first channel configured to flow a gas in a first direction and a second channel configured to flow the gas in a second direction. The housing is configured to couple to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region within the first channel, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. A sensor die is coupled to the inner region of the substrate, having an electrical connection to the electrical contact pads. The sensor die is disposed within a gas flow path of the first channel.
A sensor assembly comprising:
A gas stick assembly, comprising:
A processing system comprising:
Dependencies are inferred from the claim text.