Protective bondline control structure
AssigneeTexas Instruments Incorporated
InventorsGanapathy Subramaniam Sivakumar, Chad Alan McKay
Life of this patent
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Abstract
In described examples, apparatus includes a first substrate that delimits a surface of a cavity and a bondline structure arranged along a periphery of the cavity, where the bondline structure extends from the first substrate, and the bondline structure configured to bond with an interposer arranged on a second substrate. The apparatus also includes a diffusion barrier on the first substrate, the diffusion barrier configured to contact the interposer and impede a contaminant against migrating from the bondline structure and entering the cavity.
Claims20
Apparatus comprising:
- a first substrate;
- a first metal layer on the first substrate;
- a second substrate;
- an interposer on the second substrate, the interposer having a recess having an edge, the interposer having a first surface in the recess on a first side of the edge and a second surface on a second side of the edge, the second surface of the interposer contacting the first metal layer at a first contact;
- and
- a second metal layer on the first surface of the interposer, the second metal layer contacting the first metal layer at a second contact, the first metal layer continuous between the first contact and the second contact.
An apparatus comprising:
- a first substrate;
- a first metal layer on the first substrate;
- a second substrate;
- an interposer on the second substrate, the interposer having a recess having a first edge, a second edge, and a surface between the first edge and the second edge;
- and
- a second metal layer on the surface of the interposer, the second metal layer contacting the first metal layer.
An apparatus comprising:
- a first substrate;
- a microelectromechanical system (MEMS) device;
- a second substrate, a cavity between the first substrate and the second substrate around the MEMS device;
- an interposer on the second substrate around the cavity, the interposer having a recess having an edge;
- a first metal layer on the first substrate;
- and
- a second metal layer on the second substrate, the second metal layer contacting the first metal layer, the second metal layer having a first edge and a second edge opposite the first edge, the first metal layer continuous from past the first edge of the second metal layer to past the second edge of the second metal layer.
Dependencies are inferred from the claim text.