Vacuum encapsulation
AssigneeObsidian Sensors, Inc.
InventorsSean C. ANDREWS, Ming YING, Edward CHAN, Bing WEN, Tallis CHANG
Life of this patent
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Abstract
Vacuum encapsulation on a wafer including: preparing a first substrate by placing a first set of seal ring metals to define a first set of bondlines and solder platforms, the first substrate providing a plurality of device areas; preparing a second substrate by placing a second set of seal ring metals to define a second set of bondlines, the second substrate providing a plurality of covers for the plurality of device areas, wherein each cover encapsulates vacuum; placing solder outside of the first and second set of bondlines; and heating to bond the first and second substrates.
Claims15
A method for vacuum encapsulation on a wafer, the method comprising:
- preparing a first substrate by placing a first set of seal ring metals to define a first set of bondlines and solder platforms, the first substrate providing a plurality of device areas;
- preparing a second substrate by placing a second set of seal ring metals to define a second set of bondlines, the second substrate providing a plurality of covers for the plurality of device areas, wherein each cover encapsulates vacuum;
- placing solder outside of the first and second set of bondlines;
- and
- heating to bond the first and second substrates.
A vacuum encapsulated device, comprising:
- a first set of seal ring metals;
- a first substrate prepared by placing the first set of seal ring metals to define a first set of bondlines and solder platforms, the first substrate providing a plurality of device areas;
- a second set of seal ring metals;
- a second substrate prepared by placing the second set of seal ring metals to define a second set of bondlines, the second substrate providing a plurality of covers for the plurality of device areas,
- wherein each cover encapsulates vacuum, and
- wherein solder is placed outside of the first and second set of bondlines on or above each solder platform.
Dependencies are inferred from the claim text.