B81B 7/0035
For maintaining a controlled atmosphere inside of the chamber containing the mems
Official title: {for maintaining a controlled atmosphere inside of the chamber containing the MEMS}
B81B7/0035 (For maintaining a controlled atmosphere inside of the chamber containing the mems) appears on 511 US grants and 625 published applications in this corpus.
Search patents in B81B- Granted patents
- 511
- Published applications
- 625
- Assignees
- 189
- Inventors
- 984
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 6 |
| 2003 | 6 | 6 |
| 2004 | 2 | 5 |
| 2005 | 8 | 14 |
| 2006 | 8 | 16 |
| 2007 | 5 | 20 |
| 2008 | 7 | 7 |
| 2009 | 4 | 14 |
| 2010 | 11 | 11 |
| 2011 | 9 | 14 |
| 2012 | 6 | 12 |
| 2013 | 15 | 17 |
| 2014 | 23 | 31 |
| 2015 | 50 | 64 |
| 2016 | 44 | 55 |
| 2017 | 53 | 62 |
| 2018 | 45 | 40 |
| 2019 | 44 | 30 |
| 2020 | 34 | 45 |
| 2021 | 27 | 28 |
| 2022 | 19 | 30 |
| 2023 | 25 | 28 |
| 2024 | 23 | 27 |
| 2025 | 25 | 25 |
| 2026 | 14 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device11 Aug 2026US 12,703,622 B2Kabushiki Kaisha Toshiba
- Semiconductor structure and manufacturing method for the same4 Aug 2026US 12,698,201 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Vacuum encapsulation24 Sep 2026US 2026/0285675 A1Obsidian Sensors, Inc.
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Device and method of manufacturing device10 Sep 2026US 2026/0265048 A1Tazmo Co., Ltd.
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Encapsulated MEMS device and method to form the same254US 8,349,635 B1Silicon Laboratories Inc. · 2013
- Micromechanical device including time-release passivant125US 5,939,785 ATexas Instruments Incorporated · 1999
- Method of manufacturing a microphone95US 7,434,305 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method91US 7,381,589 B2Knowles Electronics, LLC · 2008