B81B 7/0041
Maintaining a controlled atmosphere with techniques not provided for in b81b7/0038
Official title: {maintaining a controlled atmosphere with techniques not provided for in B81B7/0038}
B81B7/0041 (Maintaining a controlled atmosphere with techniques not provided for in b81b7/0038) appears on 194 US grants and 234 published applications in this corpus.
Search patents in B81B- Granted patents
- 194
- Published applications
- 234
- Assignees
- 90
- Inventors
- 457
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 3 |
| 2004 | 0 | 0 |
| 2005 | 4 | 5 |
| 2006 | 1 | 4 |
| 2007 | 1 | 4 |
| 2008 | 3 | 5 |
| 2009 | 1 | 5 |
| 2010 | 5 | 4 |
| 2011 | 2 | 5 |
| 2012 | 3 | 5 |
| 2013 | 5 | 4 |
| 2014 | 6 | 16 |
| 2015 | 18 | 33 |
| 2016 | 18 | 23 |
| 2017 | 26 | 19 |
| 2018 | 12 | 12 |
| 2019 | 17 | 11 |
| 2020 | 13 | 19 |
| 2021 | 13 | 7 |
| 2022 | 8 | 12 |
| 2023 | 8 | 12 |
| 2024 | 7 | 11 |
| 2025 | 13 | 10 |
| 2026 | 5 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Inertial sensor, method for manufacturing inertial sensor, and inertial measurement unit19 May 2026US 12,631,665 B2Seiko Epson Corporation
- Packaging method and associated packaging structure27 Jan 2026US 12,534,361 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Vacuum encapsulation24 Sep 2026US 2026/0285675 A1Obsidian Sensors, Inc.
- Forming a Bonded Interface Using Plasma-Activated Surfaces9 Apr 2026US 2026/0097953 A1Quantum Valley Ideas Laboratories
- MEMS Sensor Module9 Apr 2026US 2026/0097955 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Transducer5 Mar 2026US 2026/0062285 A1Seiko Epson Corporation
- Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature25 Dec 2025US 2025/0388459 A1Stathera IP Holdings Inc.
Most cited
By later US patents
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Packaging micromechanical devices79US 6,433,411 B1Agere Systems Guardian Corp. · 2002
- MEMS integrated pressure sensor devices and methods of forming same66US 9,040,334 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Composite sensor device and method of producing the same64US 7,004,025 B2Murata Manufacturing Co., Ltd. · 2006
- Apparatus comprising and a method for manufacturing an embedded MEMS device53US 9,593,009 B2Infineon Technologies AG · 2017