Apparatus comprising and a method for manufacturing an embedded MEMS device
AssigneeInfineon Technologies AG
InventorsEdward Fuergut, Horst Theuss, Rainer Leuschner
Life of this patent
Estimating the term…
Abstract
A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.
Claims23
A packaged microphone comprising:
- a single unit encapsulation body providing a first main surface and a second main surface of the packaged microphone;
- a microphone disposed on the first main surface but not on the second main surface of the packaged microphone, the microphone comprising:
- a movable membrane disposed on a main surface of the microphone;
- and
- a backplate adjacent to the movable membrane;
- a back volume defined by the encapsulation body, wherein the encapsulation body has a direct interface with the back volume;
- and
- a lid disposed on the second main surface of the packaged microphone.
A device comprising:
- a chip;
- a transducer disposed adjacent to the chip;
- and
- a single unit encapsulation body encapsulating the chip and the transducer, the encapsulation body defining a transducer opening next to the transducer, wherein the encapsulation body separates the chip from the transducer opening, and wherein the encapsulation body includes a direct interface with the transducer opening.
A device comprising:
- a transducer;
- and
- a single unit encapsulation body encapsulating the transducer and a transducer opening adjacent to the transducer, wherein the encapsulation body defines the transducer opening, wherein the encapsulation body comprises a molding compound, and wherein the encapsulation body has a direct interface with the transducer opening.
A device comprising:
- a chip;
- a transducer disposed adjacent to the chip;
- and
- an encapsulation material encapsulating the chip, the transducer and a transducer opening next to the transducer, wherein the transducer opening is defined by the encapsulation material, wherein the encapsulation material separates the chip from the transducer opening, wherein the transducer opening extends beyond an outline of the transducer wherein the encapsulation material is a monolithic encapsulation material, and wherein the encapsulation material is a molding compound.
Dependencies are inferred from the claim text.