B81B 7/0038
Using materials for controlling the level of pressure, contaminants or moisture inside
Official title: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters}
B81B7/0038 (Using materials for controlling the level of pressure, contaminants or moisture inside) appears on 292 US grants and 352 published applications in this corpus.
Search patents in B81B- Granted patents
- 292
- Published applications
- 352
- Assignees
- 129
- Inventors
- 573
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 5 |
| 2003 | 4 | 3 |
| 2004 | 2 | 5 |
| 2005 | 4 | 9 |
| 2006 | 7 | 12 |
| 2007 | 4 | 6 |
| 2008 | 4 | 2 |
| 2009 | 3 | 9 |
| 2010 | 6 | 8 |
| 2011 | 7 | 9 |
| 2012 | 3 | 7 |
| 2013 | 10 | 12 |
| 2014 | 16 | 13 |
| 2015 | 27 | 25 |
| 2016 | 22 | 29 |
| 2017 | 25 | 39 |
| 2018 | 29 | 26 |
| 2019 | 26 | 18 |
| 2020 | 21 | 23 |
| 2021 | 11 | 17 |
| 2022 | 11 | 16 |
| 2023 | 15 | 15 |
| 2024 | 12 | 15 |
| 2025 | 13 | 15 |
| 2026 | 9 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Micromechanical device comprising a hydrogen drainage layer14 Jul 2026US 12,679,721 B2Robert Bosch GmbH
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Wafer level vacuum packaging (WLVP) of thermal imaging sensor19 May 2026US 12,631,491 B2Meridian Innovation Pte Ltd
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Device and method of manufacturing device10 Sep 2026US 2026/0265048 A1Tazmo Co., Ltd.
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
- Airtight structure, method for manufacturing same, and base resin composition for maintaining airtightness13 Aug 2026US 2026/0233988 A1Resonac Corporation
Most cited
By later US patents
- Encapsulated MEMS device and method to form the same254US 8,349,635 B1Silicon Laboratories Inc. · 2013
- Micromechanical device including time-release passivant125US 5,939,785 ATexas Instruments Incorporated · 1999
- Method of manufacturing a microphone95US 7,434,305 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method91US 7,381,589 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method89US 8,018,049 B2Knowles Electronics, LLC · 2011