Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device
AssigneeKabushiki Kaisha Toshiba
InventorHiroki Hiraga
Life of this patent
Estimating the term…
Abstract
According to one embodiment, an electronic device includes a housing, a first member, an electronic element, a getter member, and a second member. The housing includes a first portion. A first gap is provided between the first portion and the first member. A space surrounded by the housing and the first member is sealed at 1 atmospheric pressure or less. The electronic element is provided in the space. The getter member is provided in the space and fixed to the first member. The second member is fixed to the first member. At least a part of the first member is provided between the getter member and the second member. A melting point of the second member is lower than a melting point of the first member.
Claims14
An electronic device, comprising:
- a housing including a first portion;
- a first member, a first gap being provided between the first portion and the first member, a space surrounded by the housing and the first member being sealed at 1 atmospheric pressure or less;
- an electronic element provided in the space;
- a getter member provided in the space and fixed to the first member;
- and
- a second member fixed to the first member, at least a part of the first member being provided between the getter member and the second member, a melting point of the second member being lower than a melting point of the first member,
- wherein
- the second member includes solder,
- the first member includes iron, nickel and cobalt,
- a concentration of nickel in the first member is not less than 28 atomic % and not more than 30 atomic %, and
- a concentration of cobalt in the first member is not less than 15 atomic % and not more than 19 atomic %.
An electronic device, comprising:
- a housing including a first portion;
- a first member, a first gap being provided between the first portion and the first member, a space surrounded by the housing and the first member being sealed at 1 atmospheric pressure or less;
- an electronic element provided in the space;
- a getter member provided in the space and fixed to the first member;
- and
- a second member fixed to the first member, at least a part of the first member being provided between the getter member and the second member, a melting point of the second member being lower than a melting point of the first member
- wherein
- the getter member includes a first region and a second region,
- a direction from the first region to the second region is along a second direction crossing a first direction from the getter member to the second member,
- the first region includes a center of the getter member on a plane crossing the first direction,
- the second region includes an outer edge of the getter member in the plane, and
- a concentration of nitrogen in the first region is higher than a concentration of nitrogen in the second region, or the second region does not include nitrogen.
A method for manufacturing an electronic device, the method comprising:
- preparing an electronic device component, the electronic device component including:
- a housing including a first portion,
- a first member, a first gap being provided between the first portion and the first member, a space surrounded by the housing and the first member being sealed at 1 atmospheric pressure or less,
- an electronic element provided in the space,
- a getter member provided in the space and fixed to the first member, and
- a second member fixed to the first member, at least a part of the first member being provided between the getter member and the second member, a melting point of the second member being lower than a melting point of the first member;
- and
- heating the second member to the melting point of the second member, or more.
Dependencies are inferred from the claim text.